S1125 Equivalent Two-Part Epoxy Adhesive

S1125 is a two-part epoxy and polyamide adhesive reference used with fluid-resistant System 25 harness components, including molded heat shrink boots and breakouts. A compatible alternative should be selected by substrate, operating temperature, fluid exposure, cure process, pack size and required shelf life. The adhesive is applied to prepared connector, backshell and cable surfaces before the molded part is recovered. This listing is for an equivalent adhesive supply option and does not imply TE or Raychem origin. Submit the molded-part material, bonded substrates, process temperature and annual consumption so the correct kit size and supporting technical data can be reviewed.

S1125 is used as a cross-reference. An alternative adhesive must be supported by its own chemistry, cure, shelf-life, temperature and fluid-resistance data; TE or Raychem approvals do not transfer.

Technical parameters are confirmed from the complete part number, drawing or application requirement before quotation.